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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. 1/ 21 tsz02201 - 0p2p0b301460 -1-2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 14? 001 driver ic for ppc high performance, high reliability 36v 2ch dc brush motor drivers for ppc's etc. b d62220 a efv general description bd62220 aefv is a built - in 2 channel h - bridge motor driver for 2 dc brush motor s or 1 stepper motor. th i s driver can facil itate low power consumption by direct pwm or pwm constant current control. there are built in protection circuits in this ic . it is possible to output an abnormal detection signal for wired - or that notifies each protection circuit operation, which contribu tes to set high reliability . features ? single power supply input (rated voltage of 36v) ? rated output current (peak) : 2.0a(2.8a) ? low on - resistance dmos output ? forward, reverse, brake, open ? power s ave f unction ? external pwm c ontrol ? pwm c onstant c urrent c ontro l (current limit function) ? built - in spike noise cancel function (external noise filter is unnecessary) ? driver for 2 dc b rush m otor ? driver for 1 stepper motor ? full step, half step (driving stepper motor) ? step d rive by e xternal dac (driving stepper motor) ? b uilt - in logic input pull - down resistor ? cross- conduction p revention c ircuit ? o utput detection signal during abnormal states (wired- or) ? t hermal shutdown circuit (tsd) ? over - current protection circuit (ocp) ? under v oltage l ock out c ircuit (uvlo) ? over v oltage l oc k out c ircuit (ovlo) ? ghost supply prevention (protects against malfunction when power supply is disconnected) ? adjacent pins short protection ? inverted mounting protection ? microminiature, ultra - thin and high heat - radiation ( exposed metal type) htssop- b28 pac kage application plain paper copier ( ppc ), multi - function printer, laser printer, inkjet printer, photo printer, fax, mini printer and etc. key specifications ? power supply voltage range: 8 to 28 [v] ? rated output current: 2.0 [a] ? rated o utput current ( peak ): 2.8 [a] ? o perating temperature range: - 25 to +85 [c] ? output on - resistance: 0.65 [] (typ) (total of upper and lower resistors) package w(typ) x d(typ)x h(max) figure 1 typical application cir cuit figure 2. typical application circuit 10 cr 18 test2 7 vcc1 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1 gnd 27 out2b 26 rnf2 rnf1s 4 rnf2s 25 17 in1b 19 in2a 16 in1a 20 in2b vref1 11 9 gnd 13 ps 15 faila vref2 12 14 test1 htssop- b28 9.70mm x 6.40mm x 1.00mm datashee t
2 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv out2b rnf1s out1a nc vref1 v ref2 ps test1 nc rnf2s gnd out1b rnf1 rnf2 out2a nc vcc2 in2a test2 in1b faila in1a in2b nc gnd cr nc vcc1 pin configuration block diagram [top view] figur e 3. pin configuration figure 4. block diagram pin descriptions pin no. pin name function pin no. pin name function 1 gnd ground terminal 1 5 faila output signal to detect abnormal states 2 out1b h bridge output terminal 16 in1a h bridge control terminal 3 rnf1 connection terminal of resistor for output current detection 17 in1b h bridge control terminal 4 rnf1s input terminal of current limit comparator 18 test2 test terminal (connected to gnd) 5 out1a h bridge output terminal 19 in2a h bridge control terminal 6 nc no connection 20 in2b h bridge control terminal 7 vcc1 power supply terminal 21 nc no connection 8 nc no connection 22 vcc2 power supply terminal 9 gnd ground terminal 23 nc no connection 10 cr c onnecti on terminal of cr for setting switching frequency 24 out2a h bridge output terminal 11 vref1 c urrent limit value setting terminal 25 rnf2s input terminal of current limit comparator 12 vref2 c urrent limit value setting terminal 26 rnf2 connection termina l of resistor for output current detection 1 3 ps power save terminal 27 out2b h bridge output terminal 14 test1 test terminal (connected to gnd) 28 nc no connection predriver uvlo regulator 16 17 11 3 control logic osc ovlo rnf1s 19 20 forward reverse b rake open forward reverse b rake open 15 4 25 10 18 13 1/8 12 rnf2s 1/8 blank time pwm control tsd ocp 24 27 26 1,9 2 5 7 7 8 6 5 3 4 2 1 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 1 5 22 14
3 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv absolute maximum ratings (ta=25 c ) parameter symbol rating unit supply voltage v cc1,2 - 0.2 to +36.0 v power dissipation pd 1.45 (note 1 ) w 4.70 (note 2 ) w input voltage for control pin v in - 0.2 to +5.5 v rnf maximum voltage v rnf 0.7 v output current i out 2.0 (note 3 ) a/ch output current (peak) i outpeak 2.8 (note 4 ) a/ch operating temperature range topr -25 to +85 c storage temperature range ts t g -55 to +150 c (note 1 ) 70mm70mm1.6mm glass epoxy board. derate by 11 . 6 mw/c when operating above ta=25c. (note 2 ) 4 - layer recommended board. derate by 3 7.6 mw/c when operating above t a=25c. (note 3) do not, however exceed pd, aso and tjmax=150c. (note 4) pulse width tw 1ms, duty 20ms caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions ( ta = - 25 to +85 c) parameter symbol range unit supply voltage v cc1,2 8 to 28 v maximum output current (continuous) i out 1.4 (note 5) a/ch (note 5 ) do not, however exceed pd, aso and tjmax=150c.
4 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv electrical characteristics (unless otherwise spec ified ta=25 c , v cc1.2 =24v ) parameter symbol limit unit condition s min typ max whole circuit current at standby i ccst - - 10 a ps=l circuit current i cc - 2.5 5.0 ma ps=h, vrefx=2v control input h level input voltage v in2h 2.0 - - v l level input voltage v in2l - - 0.8 v h level input current i in2h 35 50 100 a v in2 =5v l level input current i in2l -10 0 - a v in2 =0v output (out1a, out1b, out2a, out2b) output on - resistance r on - 0.65 0.85 i out = 1.0 a (sum of upper and lower) output le ak current i leak - - 10 a current control rnfx input current i rnf -80 -40 - a rnfx=0v vrefx input current i vref - 2.0 - 0.1 - a vrefx=0v vrefx input voltage range v vref 0 - 2.0 v minimum on time (blank time ) t onmin 0.7 1.5 3.0 s current limit comparator threshold v cth 0.23 0.25 0.27 v vrefx=2v
5 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv application information 1. points to notice for terminal description and pcb layout (1) ps/ power save terminal ps can make circuit into standby state and make motor output s open. please be careful because there is a delay of 40s (max) before it returns from off state to normal state. ps state l power save (standby) h active (2) in1a,i n1b, in2a, in 2b / h bridge control terminal it decides output logic for h bridge. input output state ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open power save (standby) h l l open open stop h h l h l forward h l h l h reverse h h h l l brake x: h or l (3) test1,test2 / terminal for testing this is the terminal used at the time of distribution test. please connect to gnd . please be careful because there is a possibility of malfunction if it is not connected to gnd. (4) vcc1,vcc2 / power supply terminal motor ? s drive current is flowing in it, so please connect it in such a way that the wire is thick & shor t and has low impedance. vcc voltage may have great fluctuation, so please connect the bypass capacitor (100uf to 470uf) as close as possible to the terminal. adjust in such a way that the v cc voltage is stable. please increase the capacitance if needed, e specially when large current or motors that have great back electromotive force are used. in addition, to reduce the power supply?s impedance in wide frequency bandwidth , parallel connection of multi - layered ceramic capacitor ( 0.01 f to 0.1 f ) is recommend ed. extreme care must be observed to make sure that the vc c voltage does not exceed the rati ng even for a moment. v cc 1 & v cc 2 are shorted inside ic, so please be sure to short vcc1 & v cc 2 externally when using. if used without shorting, malfunction or dest ruction may occur because of concentration of current routes etc., so please make sure that they are shorted when in use. moreover, there is a built - in clamp component in the output terminal to prevent electrostatic destruction. if sudden pulse or surge vo ltage of more than the maximum absolute rating is applied, the clamp component operates which can result to destruction. please be sure to not exceed the maximum absolute rating. it is effective to mount a zener diode with maximum absolute rating. also, di ode is inserted between vcc terminal and gnd terminal to prevent electrostatic destruction. if reverse voltage is applied between vcc terminal and gnd terminal, there is a danger of ic destruction so please be careful. (5) gnd / ground terminal in order to red uce the noise caused by switching current and to stabilize the internal reference voltage of ic, please connect it in such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest electrical potential no matter wh at operating state it may be. (6) out1a,out1b,out2a,out2b / h bridge output terminal motor?s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low impedance. it is also effective to add a schottky diode if output has great positive or negative fluctuation when large current is applied. for example, a counter electromotive voltage etc. is great. moreover, there is a built - in clamp component in the output terminal to prevent electrostatic destruction. if su dden pulse or surge voltage of more than the maximum absolute rating is applied, the clamp component operates which can result to destruction. please be sure to not exceed the maximum absolute rating. (7) rnf1,rnf2 / connection terminal of resistor for detecti ng of output current please connect the resistor of 0.1 to 0.3 for current detection between this terminal and gnd a ccording to application circuits (fig ure 3 , 4) and consider the power consumption of the current - detecting resistor . determine the resistor in such a way that w=i out 2 ? r[w] does not exceed t he power dissipation of the resistor . in addition, please connect it in such a way that it has low impedance and does not have impedance in common with other gnd patterns . this is because motor ? s drive curr ent flows in the pattern through rnf terminal to current - detecting resistor to gnd. please do not exceed the rating because there is the possibility of circuits ? malfunction etc. if the rnf voltage has exceeded the maximum rating (0.7v). moreover, please b e careful not to short rnf terminal to gnd because there is the danger that ocp or tsd will operate when large current flows without normal pwm constant current control .. however, if rnf terminal is open, there is also the possibility of malfunction becaus e output current does not flow either. please do not let it open.
6 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv (8) rnf1s,rnf2s / input terminal of current limit comparator in this series, rnfs terminal, which is the input terminal of current limit comparator, is independently arranged in order to decreas e the lowering of current - detection accuracy caused by the wire impedance inside the ic of rnf terminal. therefore, please make sure to connect rnf terminal and rnfs terminal together when using pwm constant current control. in addition, in case of interco nnection, the low er ing of current - detection accuracy caused by the impedance of board pattern between rnf terminal and the current - detecting resistor can be decreased because the wires from rnfs terminal is connected near the current - detecting resistor. mo reover, please design the pattern in such a way that there is no noise spike. (9) vref1,vref2 / output current value - setting terminal this is the terminal to set the output current value for pwm constant current control or motor locking . the output current val ue can be set by vref voltage and current - detecting resistor (rnf resistor). [ ] [ ] ( ) { } [ ] ? = rnf / ic inside ratio division 8 / v vref a iout current output please avoid using it with vref terminal open. if vref terminal is open, there is possibility of malfunctions as the setting current increases and a larg e current flows etc. this is caused by unstable input and increasing vref voltage. please take note of the input voltage range because if voltage of over 2 v is applied on vref terminal, there is also a danger that large current flows in the output and ocp or tsd will operate. also, when selecting the resistance value please take into consideration the outflow current (max 2a) produced by resistance division. the minimum current, which can be controlled by vref voltage, is determined by motor coil?s l & r v alues and minimum on time. there is a minimum on time in pwm drive. (10) cr/ c onnection terminal of cr for setting switching frequency this is the terminal to set the switching frequency of the output. please connect the external c (330p f to 680pf) and r ( 10k to 150k ) between this terminal and gnd. please refer to page 8 . please connect the external components to gnd in such a way that the interconnection does not have impedance in common with other gnd patterns. in addition, please create the pattern design in such a way to keep such sudden pulses as square wave etc. away and that there is no noise spike. please mount the two components of c and r if pwm constant current control is being used. this is because normal pwm constant current control cannot be used if cr terminal is open or it is biased externally. when not using pwm constant current control, connect this terminal to gnd. (11) faila / fault signal output terminal faila outputs low signal when o ver -c urrent p rotection (ocp) or t hermal s hutdown (tsd) operat e s. even if u nder v oltage l ock o ut (uvlo) or o ver v oltage l ock o ut (ovlo) operates, faila signal doesn ? t turn low (i.e. high). this terminal is an open drain type, so please set the pull up resistor (5k ? to 100k ? ) to power supply less than 7v (i.e. 5v or 3.3v). if not using this terminal, please connect it to gnd. ocp tsd faila off off h (off) off on m (on) on off l (on) on on l (on) (12) nc terminal this terminal is unconnected electrically with ic internal circuit. (13) ic back metal for htssop - b28 package, the metal heat sink is mounted on ic?s back side. it becomes a prerequisite to use this metal as heat sink so please secure the heat sink area sufficiently by soldering it to the gnd plane on the board . get as wide gnd pattern as possible. please be caref ul because the allowable power dissipation as shown in page 14 cannot be attained if the metal heat sink is not connected by solder. moreover, the back side metal is shorted with ic chip?s back side and it becomes the gnd potential, so there is adanger of malfunction and destruction if it is shorted with potentials other than gnd. therefore; please do not design patterns other than gnd through the ic?s back side.
7 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv protection circuits (14) thermal shutdown (tsd) this ic has a built - in t hermal s hutdown circu it for thermal protection. when the ic ? s chip temperature rises above 175c (typ), the motor output becomes open . also, when the temperature returns to under 150 c (typ), it automatically returns to normal op eration. however, even when tsd is in operation, if heat is continued to be applied externally, heat overdrive can lead to destruction. (15) over - current protection (ocp) this ic has a built in over - current protection circuit as a provision against destruction when the motor outputs are shorted to each othe r or vcc - motor output or motor output - gnd is shorted. this circuit latches the motor output to open condition when the regulated threshold current flows for 4s (typ). it returns with power reactivation or a reset of the ps terminal. the over - current prote ction circuit aims to prevent the destruction of the ic only from abnormal situations such as when motor output is shorted and it is not meant to be used as protection or security for the device. therefore, the device should not be designed to make use of the function of this circuit. after ocp operation , if abnormal situations continues and return ed by power reactivation or reset of the ps terminal happens repeat ed ly , then ocp operates constantly. the ic may generate heat or otherwise deteriorate. when the l value of the wiring is great due to the long wiring and the over - current flows, the output terminal voltage increases and the absolute maximum values may be exceeded. as a result, there is a possibility of destruction . also, when a current flows, which is ove r the output current rating and under the ocp detection current, the ic can heat up to over tjmax=150 c . this can deteriorate the ic. therefore, current which exceeds the output rating should not be applied. (16) under voltage lock out (uvlo) this ic has a built - in under voltage lock o ut function to prevent false operation such as ic output during power supply under voltage. when the applied voltage to the v cc terminal goes under 5v (typ), the motor output is set to open. this switching voltage has a 1v ( typ) hysteresis to prevent false operation by noise etc . please be aware that this protection circuit does not operate during power save mode. (17) over voltage lock out (ovlo) this ic has a built - in over voltage l ock o ut function to protect the ic output and the motor during power supply over voltage. when the applied voltage to the vcc terminal goes over 32v (typ), the motor output is set to open. this switching voltage has a 1v (typ) hysteresis and a 4s (typ) mask time to prevent false operation by noise et c . although this over voltage locked out circuit is built - in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded. therefore, the absolute maximum value should not be exceeded. please be aware that this protection circuit does not operate during power save mode. (18) ghost supply prevention (protects against malfunction when power supply is disconnected) if a control signal (in1a, in1b, in2a, in2b, ps, vref1, vref2) is applied when there is no power supplied to the ic, there is a function which prevents false operation by voltage applied via the electrostatic destruction prevention diode from the control input terminal to the vcc, to this ic or to another ic?s power supply. therefore, there is no malfunction i n the circuit even when voltage is supplied to these input terminal s while there is no power supply.
8 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv 2. external pwm control this series can drive motors by in1a, in1b, in2a, and in2b input directly from the microcomputer ( up to 100khz). decay mode can be sl ow decay or fast decay. slow decay (forward rotation) fast decay ( synchronous rectifica tion, forward rotation) fig ure 5. route of regenerative current dur ing current decay input output state ps in1a in2a in1b in2b out1a out2a out1b out2b h h l h l on h h h l l slow decay h h l h l on h h h l l slow decay h h l h l on input output state ps in1a in2a in1b in2b out1a out2a out1b out2b h h l h l on h l h l h fast decay h h l h l on h l h l h fast decay h h l h l on on to off o ff to on m on to off o ff to on fast decay slow decay on to off o ff to on m on to on o ff to off output on current decay
9 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv 3. pwm constant current control this function can limit the peak current or switching current in driving dc brush motor. in addition, it can drive bipolar stepper motor by pwm constant current control. (1) current control operation when the output transistor is turned on, the output current increases which raises the voltage over the current sense resistor. when the voltage on the rnf pin reaches the voltage value set by the vref input voltage, the current limit comparator operates and enters current decay mode. the output is then held off for a period of time determined by the rc time constant connected to the cr pin. the process repeats itself constantly for pwm operation. (2) blank time ( fixed in internal circuit ) in order to avoid misdetectio n of output current due to rnf spikes that may occur when the output turns on, the ic employs an automatic current detection - masking period (t onmin 1.5 s typ ). during this period, the current detection is disabled immediately after the output transistor is turned on. this allows for constant - current drive without the need for an external filter. (3) cr timer the cr component connected to the cr pin is repeatedly charged and discharged between the vcrh and vcrl levels. the cr continues to discharge during this period until it reaches vcrl, at which point the ic output is switched back on. the cr charge time (t charge ) and discharge time (t discharge ) are set by external components, according to the following formulas. the total of t charge and t discharge yield the switching period, t switch . [ ] ( ) ( ) ( ) [ ] ( ) r ' r / r v v 0 . 1 v / 4 . 0 v in r ' r / r ' r c s t cr cr cr e arg ch + ? = ? ? ? + ? ? = where: v is the internal regulator voltage 5v(typ) r' is the cr internal impedance 5k ? (typ) [ ] ( ) [ ] 4 . 0 / 1 in r c s t e arg disch a + ? ? ? = : see the right graph [ ] e arg disch e arg ch chop t t s t + = setting range: c (330pf to 680pf), r (10k ? to 150k ? ) fig ure 6. timing chart of cr voltage , rnf voltage and output current cr voltage rnf voltage output current spike noise current limit value gnd vcrh(1.0+ typ) vcrl(0.4v typ) gnd 0ma current limit value switching period t switch 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 200 400 600 800 c [pf] [v]
10/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv 4. control sequence of stepper motor the following sequence can control the stepper motor by full s tep or half step mode. example of control sequence and torque vector in1a in1b in2a in2b out1a out1b out2a out2b h l h l h l h l l h h l l h h l l h l h l h l h h l l h h l l h figure 7. full step control sequence figure 8. half step control sequence in1a in1b in2a in2b out1a out1b out2a out2b h l l l h l open open h l h l h l h l l l h l open open h l l h h l l h h l l h l l l h open open l h l h l h l h l l l h open open l h h l l h h l l h 1 4 3 2 100% out2b out1b out2a out1a full step 100% -100% 100% -100% iout(ch1) iout(ch2) in1a in1b in2a in2b 2 8 6 4 100% 1 5 7 3 out1a out2b out2a out1b half step iout(ch1) iout(ch2) in1a in1b in2a in2b 100% -100% 100% -100%
11 / 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv 5. step drive for stepper motor output current of channel 1 and channel 2 can be determined by vref1, vref2. output logic can be done by in1a, in1b, in2a, in2b. therefore, linear voltage input by external dac to vref1, vref2 enabl es to drive stepper motor in step mode. figure 9 . step control sequence and output current 6. power dissipation please confirm that the ic ? s chip temperature tj is not over 150 c . consider the ic ? s power consumption (w), package power ( pd) and ambient temperature (ta). when tj=150 c is exceeded , the functions as a semiconductor do not operate and problems such as parasitic and leaks occur. constant use under these conditions leads to deterioration and eventually destruction of the ic. tj max=150 c must be strictly obeyed under all circumstances. (1) thermal calculation the ic ? s consumed power can be estimated roughly with the power supply voltage (v cc ), circuit current (i cc ), output on - resistance (r onh , r onl ) and motor output current value (i out ). the calculation method during external pwm drive, slow decay , driving ch annel 1 only is shown here: when using both ch annel 1 and ch annel 2, calculate for each h bridge. [ ] [ ] [ ] a i v v w v the of power consumed cc cc cc ? = ??????? [ ] [ ] [ ] ( ) [ ] [ ] [ ] ( ) [ ] [ ] ( ) decay current during 100 / % duty _ on 100 a iout ronl 2 on output during 100 / % duty _ on a iout ronl ronh w dmos output the of power consumed 2 2 ? ? ? ? ? ? ? ? + ? = however, on duty : p wm on duty [%] model number upper p - c h annel dmos on - resistance r onh [ ? ] (typ) lower n - c h annel dmos on - resistance r onl [ ? ] (typ) bd62220 a efv 0.4 0.25 consumed total power of ic w_total [w] = + [ ] [ ] [ ] w total _ w w / c ja c ta tj e temperatur junction ? + = however, the thermal resistance v alu e ja [ c/w] differs significantly depending on circuit board conditions. refer to the power dissipation curve on page 1 4 . also, we are taking measurements of thermal resistance value ja of the actual boards used. please feel free to contact our salesm an. the calculated values above are only theoretical. for actual thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal design with enough margin to not exceed tjmax=150 c. although not normally used, if the ic is to be used under specific or strict heat conditions, please consider attaching an external schottky diode between the motor output terminal and gnd to decrease heat from the ic. in1a in1b in2a in2b vref1 vref2 out (ch1) out (ch2) ???
12/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv (2) temperature monitoring there is a way to directly measure the approximate chip temperature by using the test 2 terminal . however, temperature monitor using test 2 terminal is only for evaluation and experimenting, and must not be used in actual usage conditions. test 2 terminal has a protection diode to prevent ele ctrostatic discharge. t he temperature may be monitored using this protection diode. (a) measure the terminal voltage when a current of i diode =50 a flows from the test 2 terminal to the gnd, without supplying vcc to the ic. this measurement is the v f voltage inside the diode. (b) measure the temperature characteristics of this terminal voltage. (v f has a linear negative temperature factor against the t emperature.) with the results of these temperature characteristics, chip temperature may be calibrated from the test terminal voltage. (c) supply vcc, confirm the test2 terminal voltage while running the motor, and the chip temperature can be approximated fro m the results of (b ). figure 10. model diagram for measuring chip temperature - vf [mv] 25 150 chip tem perature tj [ c] test2 circuitry v circuitry i diode vcc
13/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv 7. application circuit diagram (1) constant voltage control or external pwm control figure 11. block diagram & application circuit diagram (a) input/output table x: h or l (b) example of external pwm control sequence slow decay ( forward rotation) fast decay ( forward rotation) input output state ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open power save (standby) h l l open open stop h h l h l forward h l h l h reverse h h h l l brake input output state ps in1a in2a in1b in2b out1a out2a out1b out2b h h l h l on h h h l l slow decay h h l h l on h h h l l slow decay h h l h l on input output state ps in1a in2a in1b in2b out1a out2a out1b out2b h h l h l on h l h l h fast decay h h l h l on h l h l h fast decay h h l h l on rnf1s m m terminal for testing c onnect to gnd. bypass capacitor. setting range is 100 f to 470 f ( electrolytic ) 0.01 f to 0.1 f( multilayer ceramic etc. ) refer to page 4 for detail. be sure to short vcc1 & vcc2. control input terminal. input pwm signal ( ~ 100khz) at external pwm control. refer to page 4 for detail. predriver 7 vcc1 uvlo regulator 16 in1a 17 in1b vref1 11 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1,9 gnd 27 out2b 26 rnf2 control logic osc ovlo rnf1s 100 f 0.1 f 19 in2a 20 in2b forward reverse b rake open forward reverse b rake open 15 faila 4 25 rnf2s cr 10 18 test2 13 ps when using the fault output function ? pull up resistor 5k ? to 100k ? . when not using the fault output function ? connect to gnd. refer to page 5 . 3.3v or 5.0v 10k ? 1/8 vref2 12 rnf2s 1/8 blank time pwm control tsd ocp power save terminal refer to page 4 for detail. 14 test1
14/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv (2 ) pwm constant current control figure 12. application circuit diagram of constant vol tage control or external pwm control (a) input/output table x: h or l input output state ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open power save (standby) h l l open open stop h h l h l forward h l h l h reverse h h h l l brake m m 82k ? 470pf terminal for testing c onnect to gnd. sets the switching frequency. setting range is c:330pf to 680pf r:10k to 150k refer to page 5, 8 for detail. bypass capacitor. setting range is 100 f to 470 f ( electrolytic ) 0.01uf to 0.1 f( multilayer ceramic etc. ) refer to page 4 for detail. be sure to short vcc1 & vcc2. current detection setting resistor. 0.1 to 0.3 refer to page 4, 5 for detail. control logic input termin al. refer to page 4 . power save terminal refer to page 4 for detail. 0.2 ? 0.2 ? predriver 7 vcc1 uvlo regulator 16 in1a 17 in1b vref1 11 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1,9 gnd 27 out2b 26 rnf2 control logic osc ovlo rnf1s 100 f 0.1 f 19 in2a 20 in2b forward reverse b rake open forward reverse b rake open 15 faila 4 rnf1s 25 rnf2s cr 10 18 test2 13 ps 3.3v or 5.0v 10k ? 1/8 vref2 12 rnf2s 1/8 blank time pwm control tsd ocp 3.3v or 5.0v 4.7k ? 4.7k ? 3.3v or 5.0v 4.7k ? 1.2k ? sets the current limit value. input range : 0 v to 2v refer to page 5 for detail. current detection setting resistor 0.1 to 0.3 refer to page 4, 5 for detail. when using the fault output function ? pull up resistor 5k ? to 100k ? . when not using the fault output function ? connect to gnd. refer to page 5 . 14 test1
15/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv i/o equivalent circuits figure 1 4 . i/o equivalent circuits 10k ? 100k ? circuitry vcc control input vref1 vref2 500 ? 5k ? vcc circuitry rnf1, rnf2 out1b out2b out1a out2a rnf1s rnf2s 5k ? faila 5k ? cr 10k ? 5k ? vreg(internal regulator) vcc
16/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv operation notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. cons ider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern wh en using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissi pation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy boar d. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can b e approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow insta ntaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operat ion under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection pr ocess. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environ ment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low cap acitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so u nless otherwise specified, unused input terminals should be connected to the power supply or ground line.
17/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv operation notes ? continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adja cent elements in order to keep them isolated. p- n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 15. example of monolithic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built - in thermal shutd own circuit that prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circu it that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. over - current protection circuit (ocp) this ic has a built - in over - current protection circuit that activates when the output is accidentally shorted. however, it is strongly advised not to subject the ic to prolonged shorting of the output. 16. operation under s trong e lectromagnetic f ield (bd62220 a efv) operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 17. the back side of the ic package (define the side where product markings are printed as front) (bd62220 a efv) there is an exposed central pad on the back side of the ic package. please mount by footprint dimensions described in the jisso information for wsof5. connect it to ground. if it is not connected to ground, there is a possibility that the device malfunctions or a large current is generated. 18. test terminal (bd62220 a efv) be sure to connect test pin to gnd.
18/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv power dissipation htssop - b28 htssop - b28 has exposed metal on the back . it is possible to dissipate heat using the through holes in the back of board as well as the surfaces with large areas of copper foil heat dissipation patterns which greatly increases power dissipation. the b ack metal is shorted to the back side of the ic chip, being a gnd potential, therefore there is a possibility for malfunction if it is shorted with any potential other than gnd. it should be avoided. also, it is recommended that the back metal is soldered onto the gnd. please note that it has been assumed that this product will be used in the condition wherein this back metal has undergone heat dissipation treatment to increase heat dissipation efficiency . ambient temperature : ta [ c] power dissipation pd [w] 1.0 100 125 0 4.70w 4 3.30w 3 1.85w 2 1.45w 1 2.0 3.0 4.0 5.0 figure 1 3. htssop - b28 power dissipation 75 50 25 150 85 measurement machine th156 ( kuwano electric ) measurement condition r ohm board board size 70mm*70mm*1.6mm (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board ? 1- layer board (copper foil on the back 0mm) board ? 2- layer board (copper foil on the back 15mm*15mm) boa rd ? 2- layer board (copper foil on the back 70mm*70mm) board ? 4- layer board (copper foil on the back 70mm*70mm) board ? ja=86.2c/w board ? j a=67.6c/w /w board ? ja=37.9c/w board ? ja =26.6c/w
19/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv selecting a model name when ordering b d 6 2 2 2 0 a e f v - e 2 rohm model package type efv : htssop - b28 packing, forming specification e2 : reel - wound e mbossed taping marking diagram htssop - b2 8 (top view) bd6 2220a ef part number marking l ot number 1pin mark
20/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv physical dimension , tape and reel information package name htssop - b28
21/ 21 tsz02201 - 0p2p0b301460 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 21.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 bd622 2 0 a efv revision history date revision changes 21 . jun .201 6 001 new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd62220aefv package htssop-b28 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd62220aefv - web page

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